服務熱線：15102826285
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FR系列有鹵素粘結片（簡稱純膠） |
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產品型號 |
膠厚度(um) |
產品編碼 |
膠厚度(um) |
包裝規格 |
應用領域 |
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FR0100 |
1（25） |
FR0400 |
4(102) |
24in(W)*250ft |
FPC多層板、硬板及軟硬結合板層間復合 |
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FR0200 |
1（51） |
FR1500 |
1/2(13) |
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FR0300 |
1（76） |
FR1501 |
0.7（18） |
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LF系列無鹵素粘結片（簡稱純膠） |
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產品型號 |
膠厚度(um) |
產品編碼 |
膠厚度(mm) |
包裝規格 |
應用領域 |
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LF0100 |
1（25） |
LF0400 |
4(102) |
24in(W)*250ft |
FPC多層板、硬板及軟硬結合板層間復合 |
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LF0200 |
1（51） |
LF1500 |
1/2(13) |
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LF0300 |
1（76） |
LF1501 |
0.7（18） |
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HXC系列黑色覆蓋膜 |
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產品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規格 |
應用領域
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HXC1215 |
0.6(15) |
12 |
249mm*200m |
蘋果項目指定的黑色環氧型epoxy覆蓋膜,保質期4個月 |
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HXC1220 |
0.8(20) |
12 |
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HXC1225 |
1(25) |
12 |
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HXC2525 |
1(25) |
25 |
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FR系列黃色覆蓋膜Coverlay（含鹵素） |
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產品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規格 |
應用領域 |
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FR0110 |
1(25) |
25 |
24in(610mm)* |
工業類通用的黃色覆蓋膜，阻燃等級比無鹵LF系列要高。 |
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FR0120 |
1(25) |
51 |
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FR7001 |
1/2(13) |
13 |
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FR7013 |
1(25) |
13 |
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LF系列黃色覆蓋膜Coverlay（無鹵素） |
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產品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規格 |
應用領域 |
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LF0110 |
1(25) |
25 |
24in(610mm)* |
光電類及工業類無鹵素黃色覆蓋膜，正常工作溫度可達140°C |
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LF0120 |
1(25) |
51 |
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LF7001 |
1/2(13) |
13 |
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LF7013 |
1(25) |
13 |
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FR系列Bondply（簡稱兩面帶膠PI，含鹵素） |
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產品型號 |
膠ADH厚度(um)兩面 |
PI厚度（um） |
包裝規格 |
應用領域 |
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FR0111 |
1(25) |
25 |
24in(610mm)* |
雙面帶膠PI，Acrylic膠系，常溫密封保存，應用于多層板內層和軟硬結合板內層，尤其針對內層2+2結構，雙面有蝕刻線路的疊層結構，良好的填充性能，優化結構，同時減少壓合次數 |
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FR0121 |
1(25) |
51 |
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FR0131 |
1(25) |
76 |
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FR0212 |
2（51） |
25 |
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FR7021 |
1/2（13） |
1/2（13） |
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FR7016 |
1(25) |
1/2（13） |
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FR7081 |
2（51） |
1/2（13） |
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FR1515 |
1/2（13） |
25 |
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LF系列Bondply（簡稱兩面帶膠PI，無鹵素） |
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產品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規格 |
應用領域 |
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LF0111 |
1(25) |
25 |
24in(610mm)* |
雙面帶膠PI，Acrylic膠系，常溫密封保存，應用于多層板內層和軟硬結合板內層，尤其針對內層2+2結構，雙面有蝕刻線路的疊層結構，良好的填充性能，優化結構，同時減少壓合次數 |
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LF0121 |
1(25) |
51 |
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LF0131 |
1(25) |
76 |
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LF0212 |
2（51） |
25 |
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LF7021 |
1/2（13） |
1/2（13） |
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LF7016 |
1(25) |
1/2（13） |
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LF7081 |
2（51） |
1/2（13） |
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LF1515 |
1/2（13） |
25 |
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HXN系列超薄黃色覆蓋膜Coverlay(環氧型) |
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產品型號 |
膠ADH厚度(um) |
PI厚度（um） |
包裝規格 |
應用領域 |
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HXN0510 |
0.4（10） |
5 |
250mm*200m |
環氧型超薄覆蓋膜，LCM模組專用，良好的柔韌性能 |
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HXN0515 |
0.6(15) |
5 |
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HXN0810 |
0.4（10） |
8 |
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HXN0815 |
0.6(15) |
8 |
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FR系列單面有膠基材（含鹵素） |
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產品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規格 |
應用領域 |
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FR9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
工業類單面有膠基材，正常工作溫度可達140°C，主要應用在工業類、光電類、汽車、醫療類 |
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FR9120R |
1(35) |
25 |
51 |
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FR9130R |
1(35) |
25 |
76 |
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FR9150R |
1(35) |
25 |
127 |
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FR系列雙面有膠基材（含鹵素） |
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產品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規格 |
應用領域 |
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FR9111R |
1(35) |
25 |
25 |
24in(610 mm)* |
雙面粘合基材，工作溫度高達140°C，主要用于工業、光電、汽車、醫療和航天領域。 |
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FR9121R |
1(35) |
25 |
52 |
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FR9131R |
1(35) |
25 |
76 |
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FR9222R |
2(70) |
25 |
127 |
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LF系列單面有膠基材（無鹵） |
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產品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規格 |
應用領域 |
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LF9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
工業類單面有膠基材，正常工作溫度可達140°C，主要應用在工業類、光電類、汽車、醫療類 |
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LF9120R |
1(35) |
25 |
51 |
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LF9130R |
1(35) |
25 |
76 |
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LF9150R |
1(35) |
25 |
51 |
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LF系列雙面有膠基材（無鹵） |
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產品型號 |
Cu OZ/ft2(um) |
膠厚度（um） |
PI厚度（um） |
包裝規格 |
應用領域 |
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LF9111R |
1(35) |
25 |
25 |
24in(610 mm)* 25 sheets in a box |
工業類單面有膠基材，正常工作溫度可達140°C，主要應用在工業類、光電類、汽車、醫療類 |
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LF9121R |
1(35) |
25 |
51 |
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LF9131R |
1(35) |
25 |
76 |
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LF9222R |
2(70) |
25 |
51 |
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無膠基材 |
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AC系列單面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規格 |
應用領域 |
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AC121200EM/R |
12(1/3 ) |
12 |
12(1/3) |
250mm*100m |
消費類電子單面無膠基材，應用于普通單面板和多層軟板 |
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AC122000EM/R |
12(1/3) |
20 |
12(1/3) |
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AC182000EM/R |
18(1/2) |
20 |
18(1/2) |
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AC182500EM/R |
18(1/2) |
25 |
18(1/2) |
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AC181200EM/R |
18(1/2) |
12 |
18(1/2) |
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AC352500EY/R |
35(1.0) |
25 |
35(1.0) |
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AC354500EY/R |
35(1.0) |
45 |
35(1.0) |
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AK系列雙面無膠基材（HTE銅） |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規格 |
應用領域 |
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AK121212EM |
12(1/3) |
12 |
12(1/3) |
250mm*100m |
消費類電子雙面無膠基材，高延展性電解銅，應用于普通雙面板和軟硬結合板內層，漲縮穩定性好 |
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AK121812EM |
12(1/3) |
18 |
12(1/3) |
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AK122512EM |
12(1/3) |
25 |
12(1/3) |
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AK125012EM |
18(1/2) |
50 |
18(1/2) |
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AK182518EM |
18(1/2) |
25 |
18(1/2) |
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AK185018EM |
18(1/2) |
50 |
18(1/2) |
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AK系列雙面無膠基材（HA銅） |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規格 |
應用領域 |
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AK122512RY |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
消費類電子雙面無膠基材，HA高延展性壓延銅，應用于普通雙面板和軟硬結合板內層，折彎性能好 |
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AK182518RY |
18(1/2) |
25 |
18(1/2) |
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AK185018RY |
18(1/3) |
50 |
18(1/2) |
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KP系列雙面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規格 |
應用領域 |
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KP122512E |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
LCD、LCM、TP、攝像頭模組及消費類電子應用基材，良好的漲縮穩定性，TD方向熱處理后3%以內，MD方便可以達5%以內。 |
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KP182518E |
18(1/2) |
25 |
18(1/2) |
250mm*100m |
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AP系列雙面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cu um(OZ/ft2) |
包裝規格 |
應用領域 |
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AP8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
工業類雙面無膠基材，正常工作溫度可達180°C，傳輸速度可達10GHZ左右,主要應用在工業類、光電模塊類、汽車、醫療、航空航天類 |
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AP8525R |
18(1/2) |
51 |
18(1/2) |
24in(610 mm)* |
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AP9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
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AP9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
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AP9131R |
1(35) |
76 |
1(35) |
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Pyralux? JT |
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產品編號 |
PI厚度（um） |
材料特性及應用領域 |
包裝規格 |
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JT25 |
25 |
Polyamideimide材質，正常工作溫度可以達150° |
24in(W)*250ft |
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JT50 |
50 |
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Pyralux? HT |
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產品編號 |
PI厚度（um） |
材料特性及應用領域 |
包裝規格 |
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HT0100 |
25 |
正常工作溫度可以耐225°；需要高溫壓機壓合，溫度達300°以上 |
24in(W)*250ft |
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HT7049 |
38 |
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HT0200 |
50 |
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HT0300 |
75 |
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HT系列工業類耐高溫的基材 |
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HT系列雙面無膠基材 |
Cu um(OZ/ft2) |
PI厚度（um） |
Cuum(OZ/ft2) |
包裝規格 |
應用領域 |
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HT8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
全聚酰亞胺系雙面無膠基材，當今耐溫值最高的軟板材料，工作溫度可達225°C以上，高結合力，優異的絕緣層厚度均勻度和電氣性能 |
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HT8525R |
18(1/2) |
51 |
18(1/2) |
24in(610mm)* |
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HT9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
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HT9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
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FR series has halogen bonding sheet (referred to as pure glue) |
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Product Model |
mil(um)Thickness of adhesive |
Product Code |
mil(um)Thickness of adhesive |
Packaging specifications |
Application Areas |
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FR0100 |
1（25） |
FR0400 |
4(102) |
24in(W)*250ft |
FPC multilayer, rigid and rigid-soft combination board interlayer lamination |
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FR0200 |
1（51） |
FR1500 |
1/2(13) |
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FR0300 |
1（76） |
FR1501 |
0.7（18） |
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LF series halogen-free bonding sheet (referred to as pure glue) |
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Product Model |
mil(um)Thickness of adhesive |
Product Code |
mil(mm)Thickness of adhesive |
Packaging specifications |
Application Areas |
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LF0100 |
1（25） |
LF0400 |
4(102) |
24in(W)*250ft |
FPC multilayer, rigid and rigid-soft combination board interlayer lamination |
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LF0200 |
1（51） |
LF1500 |
1/2(13) |
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LF0300 |
1（76） |
LF1501 |
0.7（18） |
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Coverlay HXC Series Black Coverlay Film Coverlay |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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HXC1215 |
0.6(15) |
12 |
249mm*200m |
Black epoxy covering film specified by Apple project, with a shelf life of 4 months |
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HXC1220 |
0.8(20) |
12 |
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HXC1225 |
1(25) |
12 |
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HXC2525 |
1(25) |
25 |
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FR series yellow overlay film Coverlay (with halogen) |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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FR0110 |
1(25) |
25 |
24in(610mm)* |
A general-purpose yellow covering film for industrial classes with a higher flame retardant rating than the halogen-free LF series. |
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FR0120 |
1(25) |
51 |
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FR7001 |
1/2(13) |
13 |
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FR7013 |
1(25) |
13 |
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LF series yellow overlay film Coverlay (with halogen) |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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LF0110 |
1(25) |
25 |
24in(610mm)* |
Halogen-free yellow covering film for optoelectronic and industrial applications, with normal operating temperature up to 140°C |
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LF0120 |
1(25) |
51 |
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LF7001 |
1/2(13) |
13 |
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LF7013 |
1(25) |
13 |
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FR series Bondply (referred to as two-sided adhesive PI, containing halogen) |
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Product Model |
mil(um)Gum ADH thicknessBoth sides |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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FR0111 |
1(25) |
25 |
24in(610mm)* |
Double-sided PI with adhesive, Acrylic adhesive system, sealed and stored at room temperature, used in the inner layer of multilayer boards and the inner layer of soft and hard combination boards, especially for the inner layer of 2+2 structure, double-sided laminated structure with etched lines, good filling performance, optimize the structure, while reducing the number of presses |
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FR0121 |
1(25) |
51 |
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FR0131 |
1(25) |
76 |
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FR0212 |
2（51） |
25 |
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FR7021 |
1/2（13） |
1/2（13） |
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FR7016 |
1(25) |
1/2（13） |
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FR7081 |
2（51） |
1/2（13） |
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FR1515 |
1/2（13） |
25 |
||
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LF series Bondply (referred to as two-sided adhesive PI, halogen-free) |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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LF0111 |
1(25) |
25 |
24in(610mm)* |
Double-sided PI with adhesive, Acrylic adhesive system, sealed and stored at room temperature, used in the inner layer of multilayer boards and the inner layer of soft and hard combination boards, especially for the inner layer of 2+2 structure, double-sided laminated structure with etched lines, good filling performance, optimize the structure, while reducing the number of presses |
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LF0121 |
1(25) |
51 |
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LF0131 |
1(25) |
76 |
||
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LF0212 |
2（51） |
25 |
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LF7021 |
1/2（13） |
1/2（13） |
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LF7016 |
1(25) |
1/2（13） |
||
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LF7081 |
2（51） |
1/2（13） |
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LF1515 |
1/2（13） |
25 |
||
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HXN series ultra-thin yellow covering film Coverlay (epoxy type) |
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Product Model |
mil(um)Gum ADH thickness |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
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HXN0510 |
0.4（10） |
5 |
250mm*200m |
Epoxy type ultra-thin covering film for LCM module, good flexibility performance |
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HXN0515 |
0.6(15) |
5 |
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HXN0810 |
0.4（10） |
8 |
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HXN0815 |
0.6(15) |
8 |
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FR series single-sided glued substrates (with halogen) |
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Product Model |
Cu OZ/ft2(um) |
Thickness of adhesive |
（um） Thickness of PI |
Packaging specifications |
Application Areas |
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FR9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
Industrial single-sided adhesive substrates, normal working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical |
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FR9120R |
1(35) |
25 |
51 |
||
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FR9130R |
1(35) |
25 |
76 |
||
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FR9150R |
1(35) |
25 |
127 |
||
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FR series double-sided adhesive substrates (with halogen) |
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Product Model |
Cu OZ/ft2(um) |
Thickness of adhesive |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
FR9111R |
1(35) |
25 |
25 |
24in(610 mm)* |
Double-sided adhesive substrate, working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical and aerospace applications |
|
FR9121R |
1(35) |
25 |
52 |
||
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FR9131R |
1(35) |
25 |
76 |
||
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FR9222R |
2(70) |
25 |
127 |
||
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LF series single-sided adhesive base material (halogen-free) |
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Product Model |
Cu OZ/ft2(um) |
（um）Thickness of adhesive |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
LF9110R |
1(35) |
25 |
25 |
24in(610 mm)* |
Industrial single-sided adhesive substrates, normal working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical |
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LF9120R |
1(35) |
25 |
51 |
||
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LF9130R |
1(35) |
25 |
76 |
||
|
LF9150R |
1(35) |
25 |
51 |
||
|
LF series double-sided adhesive base material (halogen-free) |
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Product Model |
Cu OZ/ft2(um) |
（um）Thickness of adhesive |
（um）Thickness of PI |
Packaging specifications |
Application Areas |
|
LF9111R |
1(35) |
25 |
25 |
24in(610 mm)* 25 sheets in a box |
Industrial single-sided adhesive substrates, normal working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical |
|
LF9121R |
1(35) |
25 |
51 |
||
|
LF9131R |
1(35) |
25 |
76 |
||
|
LF9222R |
2(70) |
25 |
51 |
||
|
Non-adhesive substrates |
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AC series single-sided non-adhesive substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
AC121200EM/R |
12(1/3) |
12 |
12(1/3) |
250mm*100m |
Consumer electronics single-sided adhesive-free substrates for general single-sided and multilayer flexible boards |
|
AC122000EM/R |
12(1/3) |
20 |
12(1/3) |
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AC182000EM/R |
18(1/2) |
20 |
18(1/2) |
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AC182500EM/R |
18(1/2) |
25 |
18(1/2) |
||
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AC181200EM/R |
18(1/2) |
12 |
18(1/2) |
||
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AC352500EY/R |
35(1.0) |
25 |
35(1.0) |
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AC354500EY/R |
35(1.0) |
45 |
35(1.0) |
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AK series double-sided adhesive-free substrates (HTE copper) |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
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AK121212EM |
12(1/3) |
12 |
12(1/3) |
250mm*100m |
Consumer electronics double-sided adhesive-free substrate, high ductility electrolytic copper, applied to the ordinary double-sided board and the inner layer of soft and hard combination board, good up and down stability |
|
AK121812EM |
12(1/3) |
18 |
12(1/3) |
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AK122512EM |
12(1/3) |
25 |
12(1/3) |
||
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AK125012EM |
18(1/2) |
50 |
18(1/2) |
||
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AK182518EM |
18(1/2) |
25 |
18(1/2) |
||
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AK185018EM |
18(1/2) |
50 |
18(1/2) |
|
AK series double-sided adhesive-free substrate (HA copper) |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
AK122512RY |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
Consumer electronics double-sided adhesive-free substrate, HA high ductility calendered copper, applied to the ordinary double-sided and soft-hard combination board inner layer, good bending performance |
|
AK182518RY |
18(1/2) |
25 |
18(1/2) |
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AK185018RY |
18(1/3) |
50 |
18(1/2) |
|
KP series double-sided adhesive-free substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
KP122512E |
12(1/3) |
25 |
12(1/3) |
250mm*100m |
LCD, LCM, TP, camera modules and consumer electronics application substrates, good up and down stability, within 3% after TD direction heat treatment, MD convenience can reach within 5%. |
|
KP182518E |
18(1/2) |
25 |
18(1/2) |
250mm*100m |
|
AP series double-sided adhesive-free substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
AP8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
Industrial double-sided adhesive-free substrates, normal working temperature up to 180°C, transmission speed up to about 10GHZ, mainly used in industrial, optoelectronic modules, automotive, medical, aerospace class |
|
AP8525R |
18(1/2) |
51 |
18(1/2) |
24in(610 mm)* |
|
|
AP9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
|
|
AP9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
|
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AP9131R |
1(35) |
76 |
1(35) |
|
Pyralux? JT Coverfilm and Bonding Material |
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Product No. |
（um）Thickness of PI |
Material properties and application areas |
Packaging specifications |
|
JT25 |
25 |
Polymide material, normal operating temperature can reach 150°. |
24in(W)*250ft |
|
JT50 |
50 |
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Pyralux? HT Coverfilm and Bonding Material |
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Product No. |
（um）Thickness of PI |
Material properties and application areas |
Packaging specifications |
|
HT0100 |
25 |
Normal working temperature can withstand 225°; need high temperature press to press together, the temperature reaches 300° or more |
24in(W)*250ft |
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HT7049 |
38 |
||
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HT0200 |
50 |
||
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HT0300 |
75 |
||
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HT series industrial class high temperature resistant substrates |
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HT series double-sided adhesive-free substrate |
Cu um(OZ/ft2) |
（um）Thickness of PI |
Cu um(OZ/ft2) |
Packaging specifications |
Application Areas |
|
HT8515R |
18(1/2) |
25 |
18(1/2) |
24in(610mm)* |
All-polyimide double-sided non-adhesive base material, the highest temperature resistance of today's flexible board materials, working temperature up to 225 ° C or more, high bonding force, excellent insulation layer thickness uniformity and electrical performance |
|
HT8525R |
18(1/2) |
51 |
18(1/2) |
24in(610mm)* |
|
|
HT9111R |
1(35) |
25 |
1(35) |
24in(610mm)* |
|
|
HT9121R |
1(35) |
51 |
1(35) |
12in(610mm)* |
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