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濕法壓膜技術源于美國杜邦集團，此技術的誕生，提高了傳統印刷精細線路開、短路的良率以及提高生產效率。杜邦公司經過多年的科研，最終開發出了能與水進行良好化學反應的干膜，如：SD200系列、ST900系列、FX900系列等多種類多用途的干膜。
杜邦濕法壓膜應用領域：
隨著市場環境的改變，杜邦濕法壓膜技術的應用也得到了廣泛的推廣，目前濕法壓膜技術在PCB、FPC、ITO（觸摸屏）與五金蝕刻方面得到了廣泛的應用，根據杜邦中國集團公司統計的數在2010年全國裝有杜邦濕法系統的設備一共238套，2012年底全國共裝有374套。
杜邦濕法貼膜的優點：
1、 使粗糙的銅表面得到完整的壓膜效果，大幅降低了開、短路引起的不良；
2、 使銅面與干膜的結合力更好；
3、 制作的線路比干壓更為精細。
濕法壓膜干膜與水反應示意圖：
圖1：壓好干膜的板材經過放大之后會看到板面凹坑內部原來的空氣經過濕法壓膜后變為了積水
圖2：經過靜止一段時間后可以看到干膜逐步與水進行化學反應，干膜逐步滲入凹坑
圖3：經過長時間的靜止發現干膜已經全部融入凹坑
注：經過浸水的銅面，可以加速與干膜的反應，將銅面上粗糙地方的氣體趕走且使干膜本身軟化而更有粘性，與銅面的結合力更緊密，并可以對銅面上的凹坑及劃傷有很大的填充作用。
杜邦濕法壓膜的發展：
杜邦中國集團公司作為干膜業內的領頭羊，多年來一直投入大量資金研發新產品。關于杜邦濕法壓膜，杜邦集團公司科技實驗室已經著手開始研發第二代濕法壓膜系統，此系統目前在部分客戶處做生產測試。根據了解到的信息，第二代杜邦濕法壓膜系統會大幅度的降低板面因灰塵、擦傷、凹凸不平等造成的開、短路。
The wet lamination technology originated from DuPont Group in the U.S. This technology was created to improve the yield of traditional printing fine lines open and short as well as improve production efficiency. After years of scientific research, DuPont finally developed dry films that can react well with water chemically, such as: SD200 series, ST900 series, FX900 series and other multi-purpose dry films.
DuPont wet lamination applications:
With the change of market environment, the application of DuPont wet lamination technology has also been widely promoted. At present, wet lamination technology is widely used in PCB, FPC, ITO (touch screen) and hardware etching, according to the statistics of DuPont China group of companies, there were 238 sets of equipment equipped with DuPont wet lamination system in 2010 and 374 sets at the end of 2012.
Advantages of DuPont wet lamination:
1、so that the rough copper surface to get a complete pressure film effect, significantly reduce the open, short circuit caused by bad
2、Better bonding of copper surface to dry film
3、The production line is more delicate than dry pressing
Schematic diagram of the reaction between wet pressed dry film and water:
Figure 1: After the magnification of the pressed dry film, you can see that the original air inside the crater of the board surface has become water after the wet lamination.
Figure 2: After a period of resting, you can see that the dry film gradually reacts with water chemically and the dry film gradually penetrates into the pits.
Figure 3: After a long time of resting, it is found that the dry film has been fully integrated into the crater.
Note: After dipping the copper surface, it can accelerate the reaction with the dry film, drive away the gas from the rough places on the copper surface and make the dry film itself soften and stickier, and the bonding force with the copper surface is closer, and it can have a great filling effect on the pits and scratches on the copper surface.
The development of DuPont wet lamination:
As a leader in the dry film industry, DuPont China Group has been investing heavily in research and development of new products for many years. Regarding DuPont wet lamination, DuPont Group's Science and Technology Laboratory has started to develop the second generation of wet lamination system, which is currently in production testing at some customers. According to the information learned, the second generation of DuPont wet lamination system will significantly reduce the open and short circuit caused by dust, scuffing, unevenness, etc. on the board surface.
